Nanoscale Lead-free Solders (“Nano-Solders”): Synthesis, Characterization, and Reflow Properties. 2008.
TURI Research Report No. 61. Nanoscale lead-free solders (“nano-solders”) have been proposed and investigated in the development of nano-soldering technique for nanoscale assembly and integration. Tin (Sn)-based and indium (In)-based lead-free nano-solders have been synthesized directly onto multisegmented nanowires using electrodeposition method in nanoporous templates. The diameter of nano-solder nanowires ranges from 50nm to 200 nm and length from 1-10 μm. The microstructure of nano-solder nanowires have been studied using optical microscope and electron microscopes (FESEM and TEM) along with energy-dispersive x-ray spectroscopy (EDS). Thermal reflow properties of nano-solders were characterized with a temperature programmable furnace tube. It was found that flux plays an important role in the nano-solder reflow process.File Name: techreport61.pdf
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