Evaluation and implementation of no-clean solder paste for surface mount technology with a focus on small contract manufacturers. 1997

TURI Technical Report No. 40

File Name: techreport40.pdf
File Size: 5.30 MB
Note: This file can be opened with Adobe Acrobat Reader

File Synopsis: Electronic assemblies that are soldered using no-clean materials do not need to be cleaned after assembly operations. The residues that they leave behind are benign to the end use reliability of the assembly. They also have inherent other benefits such as the elimination of cleaning equipment, waste effluent and other related costs. This study addresses the implementation of no-clean solder pastes for a small contract manufacturing situation. the issues regarding the cleaning of electronics are discussed as well as the mechanics of the no-clean material involved. Download file...