TURI » Our Work » Business » Industry Sectors » Electronics » New England Lea... » Papers and Presentations  

Papers and Presentations


Supply Chain Collaboration to Achieve Toxics Use Reduction

  Journal of Cleaner Production, Volume 19, Issue 5, March 2011. Download PDF file (1.42 MB)

A Successful Transition To Lead-Free

  August 2006 article published in SMT Magazine, co-authored by Greg Morose, project manager at TURI. The article documents the positive test results of an actual implementation of a lead-free printed wiring board for Mercury Computer Systems. Download PDF file (136.35 kB)

Brooks Instrument, LLC. Lead-free Electronics Implementation. 2008.

  TURI Technical Report No. 59. During 2007 and 2008, the Institute worked with representatives from Benchmark Electronics, Brooks Instrument, and Emerson Process Management to conduct and document a lead-free electronics implementation for a high reliability electronics product that is exempt from the European RoHS Directive. The research information provided by the New England Lead-free Consortium, as well as the information contained in this case study, is of high value to companies that need to transition to lead-free electronics for their high reliability products. The Institute's university research program continues to fund research efforts to reduce the use of toxic chemicals in the electronics industry. Download PDF file (5.56 MB)

Failure Analysis Results for Evaluating the Long-Term Reliability of Test Vehicles Assembled with Lead-free Materials

  Paper submitted for IMAPS New England, 38th Symposium and Expo, Boxborough, MA, May 3, 2011. Download PDF file (319.03 kB)

Getting the lead out of electronics. 2009

  This fact sheet provides a summary of the successful efforts of the New England Lead-free Electronics Consortium. Download PDF file (424.23 kB)

Lead Free Through Hole Rework on a Thick Heavy Assembly

  This article is in the August 2007 issue of Circuits Assembly. Download PDF file (5.46 MB)

Transition to Lead-Free Electronics Case Study

  Transition to Lead-Free Electronics Case Study, presented at IPC/JEDEC Lead Free Conference August 2006 Download file (2.76 MB)

Phase III - Visual and Reliability Testing Results

  Visual and Reliability Testing Results of Circuit Boards Assembled with Lead-Free Components, Soldering Materials, and Processes. APEX February 2006 Download file (3.21 MB)
1 2

Next >>