TURI » Our Work » Business » Industry Sectors » Electronics » New England Lea... » Papers and Pres... » Quality and Reliability Testing...  

Quality and Reliability Testing of Circuit Boards Assembled with Lead Free Components, Finishes, Soldering Materials and Processes in Simulated Production Conditions

Paper submitted for Electronics Industry Conferences

File Name: Pan Pacific Paper 2009 version 121008.pdf
File Size: 228.02 kB
Note: This file can be opened with Adobe Acrobat Reader