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Developing and Analyzing Lead-Free Soldering Processes for Printed Wiring Boards. 2000.

TURI Technical Report No. 52. Researchers on this project formed an industry-led "UMASS Lead-Free Consortium" (the Consortium) of local and national companies to evaluate various emerging alternatives to lead-based solders and finishes. The consortium members donated expertise, time, materials and equipment to this project. The various alternatives to lead-bearing materials, surface finishes and manufacturing processes were evaluated as factors in a set of designed experiments, and compared the results to a baseline of standard leaded processes and materials, using the quality characteristics of visual, mechanical and thermal testing criteria. The Manufacturing Research Laboratory facilities at UMASS Lowell were utilized to test and analyze the performance of alternatives based on the principles of Design of Experiments. Results were analyzed using statistical techniques resulting in determining whether a particular factor was significant to the quality characteristic being measured. A theoretical percent contribution to the total quality characteristic was calculated for significant factors.

File Name: Report 52 - shina 2000.pdf
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