Phase II - Lead Free Reliability Test Results
Lead Free Reliability Test Results
File Name:
LEADFREE RELIABILITY TEST RESULTS.doc
File Size: 1.40 MB
File Synopsis:
ABSTRACT
The worldwide movement to phase out lead from electronic
products presents challenges for companies throughout the electronics supply
chain. The University of Massachusetts Lowell has brought together eight Massachusetts firms to collaborate on the
manufacture and testing of lead-free printed wiring boards (PWBs). The results of the first set of experiments,
published in 2001, showed that zero-defect soldering is achievable with
lead-free materials. After thermal cycling, the PWBs were visually inspected
and the leads were pull tested for reliability analysis. They compared
favorably to a baseline of lead soldered PWBs
A follow-on design of experiments was created in 2002 and a
second set of test PWBs with a wide variety of components was
manufactured. Several solder pastes
based on Sn/Ag/Cu were used with a variety of PWB surface finishes, and
reflowed using either air or nitrogen.
Visual inspection results have been completed and published, This paper
discusses the results of the pull-testing phase of the project. Future work to
be completed includes thermal cycling and subsequent pull testing. Results will
be published in future papers at electronics conferences.
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