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Papers and Presentations


Brooks Instrument, LLC. Lead-free Electronics Implementation. 2008.

  TURI Technical Report No. 59. During 2007 and 2008, the Institute worked with representatives from Benchmark Electronics, Brooks Instrument, and Emerson Process Management to conduct and document a lead-free electronics implementation for a high reliability electronics product that is exempt from the European RoHS Directive. The research information provided by the New England Lead-free Consortium, as well as the information contained in this case study, is of high value to companies that need to transition to lead-free electronics for their high reliability products. The Institute’s university research program continues to fund research efforts to reduce the use of toxic chemicals in the electronics industry. Download PDF file (5.56 MB)

Lead Free Through Hole Rework on a Thick Heavy Assembly

  This article is in the August 2007 issue of Circuits Assembly. Download PDF file (5.46 MB)

Transition to Lead-Free Electronics Case Study

  Transition to Lead-Free Electronics Case Study, presented at IPC/JEDEC Lead Free Conference August 2006 Download file (2.76 MB)

Phase III - Visual and Reliability Testing Results

  Visual and Reliability Testing Results of Circuit Boards Assembled with Lead-Free Components, Soldering Materials, and Processes. APEX February 2006 Download file (3.21 MB)

Phase II - A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques

  A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques (SMTA 2003) Download PDF file (1.25 MB)

Phase II - Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes

  Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes Download PDF file (373.90 kB)

Phase I - Zero Defects Lead Free Soldering Presentation at STEP

  Zero Defects Lead Free Soldering Presentation at STEP (STEP Presentation 2001) Download PDF file (126.55 kB)
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