New England Lead-Free Electronics Consortium
Papers and Presentations
Lead Free
- Lead Free Through Hole Rework on a Thick Heavy Assembly
- Transition to Lead-Free Electronics Case Study - Part II Product Reliability and Forced Rework
- Transition to Lead-Free Electronics Case Study
- Phase III - Visual and Reliability Testing Results
- Phase III - Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes, 2005
Drivers of Change |
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| WEEE and RoHS - getting the lead out Read more... | |
Consortium Overview Presentation
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| New England Lead Free Electronics Consortium Overview by Greg Morose. Download PDF file (939.13 kB) |
Lead Free Assembly Process FMEA
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| Analysis by New England Lead Free Electronics Consortium, TURI Lead Free FMEA Group. Lead free assembly process potential failure mode and effects analysis. Download PDF file (40.47 kB) |