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Papers and Presentations


Lead Free Through Hole Rework on a Thick Heavy Assembly

  This article is in the August 2007 issue of Circuits Assembly. Download PDF file (5.46 MB)

Transition to Lead-Free Electronics Case Study

  Transition to Lead-Free Electronics Case Study, presented at IPC/JEDEC Lead Free Conference August 2006 Download file (2.76 MB)

Phase III - Visual and Reliability Testing Results

  Visual and Reliability Testing Results of Circuit Boards Assembled with Lead-Free Components, Soldering Materials, and Processes. APEX February 2006 Download file (3.21 MB)

Phase II - A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques

  A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques (SMTA 2003) Download PDF file (1.25 MB)

Phase II - Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes

  Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes Download PDF file (373.90 kB)

Phase I - Zero Defects Lead Free Soldering Presentation at STEP

  Zero Defects Lead Free Soldering Presentation at STEP (STEP Presentation 2001) Download PDF file (126.55 kB)

Phase I - Zero Defects Lead Free Soldering

  Zero Defects Lead Free Soldering (SMTA Presentation 2001) Download PDF file (348.25 kB)
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