Electronics
The New England Lead-Free Electronics Consortium connects peers in industry with their suppliers and markets to address industry challenges and build local competitiveness. Several years of testing and experiments, as well as supply chain workshops and communication have resulted in a large archive of practical presentations, papers, and articles available for downloading.
To learn more about or join this consortium, contact Greg Morose at 978-934-2954.
"Lead free through hole Rework on a Thick Heavy Assembly", by Robert Farrell, Paul Bodmer, Bruce Tostevin, Richard Russo, and Gregory Morose. This article is in the August 2007 issue of Circuits Assembly.
About the Consortium:
Sponsored by TURI, The University of Massachusetts Lowell, and the U.S. EPA, the Consortium has been working since 2000 to improve the conversion process to lead-free. The Consortium is a collaborative effort among companies that represent the entire printed wiring board (PWB) supply chain. The goal of Consortium projects is to achieve a level of lead-free solder joint manufacture and reliability comparable or better to that of leaded solder joints. Consortium members working with TURI, university researchers and students ran an exhaustive set of experiments to test materials, manufacturing processes and reflow strategies.
Lead-free conversion testing parameters included material selection (raw PWBs, component finishes, solders and fluxes); process selection (reflow parameters, temperatures and environment); mix of component types and finishes; acceptability (visual inspection); reliability; and planning to address consequences to lead-free conversion. The consortium has also employed six sigma tools (DOE, FMEA, etc.) to focus research efforts and enhance the quality of testing results.
This page updated Wednesday October 31 2007