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Papers and Presentations

Supply Chain Collaboration to Achieve Toxics Use Reduction

  Journal of Cleaner Production, Volume 19, Issue 5, March 2011. Download PDF file (1.42 MB)

A Successful Transition To Lead-Free

  August 2006 article published in SMT Magazine, co-authored by Greg Morose, project manager at TURI. The article documents the positive test results of an actual implementation of a lead-free printed wiring board for Mercury Computer Systems. Download PDF file (136.35 kB)

Transition to Lead-Free Electronics Case Study

  Transition to Lead-Free Electronics Case Study, presented at IPC/JEDEC Lead Free Conference August 2006 Download file (2.76 MB)

Phase III - Visual and Reliability Testing Results

  Visual and Reliability Testing Results of Circuit Boards Assembled with Lead-Free Components, Soldering Materials, and Processes. APEX February 2006 Download file (3.21 MB)

Phase III - Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes, 2005

  Article published in SMT magazine related to TURI's Lead-Free work. The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout the electronics supply chain. The University of Massachusetts at Lowell has brought together many Massachusetts/New England firms to collaborate on the manufacture and testing of lead-free printed wiring boards (PWBs). The results of the first set of experiments, published in 2001, showed that zero-defect soldering is achievable with lead-free materials. Following thermal cycling, the PWBs were visually inspected and the leads were pull-tested for reliability analysis. They compared favorably to a baseline of lead soldered PWBs A follow-on design of experiments was created in 2002 and a second set of test PWBs was made and tested in 2003. Three lead-free solder pastes based on Sn/Ag/Cu alloys were reflowed using either air or nitrogen with five PWB surface finishes, four component types with two types of component finish. Visual inspection and pull-testing were performed and published as completed in APEX, SMTI and IEEE conferences. This paper summarizes the testing results and introduces further research plans in volume manufacturing of lead free PWBs for the phase III testing sponsored by the EPA. Download PDF file (388.79 kB)

Phase II - A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques

  A Comparative Analysis of Lead Free Materials and Processes Using Design of Experiments Techniques (SMTA 2003) Download PDF file (1.25 MB)

Lead Free Through Hole Rework on a Thick Heavy Assembly

  This article is in the August 2007 issue of Circuits Assembly. Download PDF file (5.46 MB)

Brooks Instrument, LLC. Lead-free Electronics Implementation. 2008.

  TURI Technical Report No. 59. During 2007 and 2008, the Institute worked with representatives from Benchmark Electronics, Brooks Instrument, and Emerson Process Management to conduct and document a lead-free electronics implementation for a high reliability electronics product that is exempt from the European RoHS Directive. The research information provided by the New England Lead-free Consortium, as well as the information contained in this case study, is of high value to companies that need to transition to lead-free electronics for their high reliability products. The Institute's university research program continues to fund research efforts to reduce the use of toxic chemicals in the electronics industry. Download PDF file (5.56 MB)
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