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Papers and Presentations


Phase III - Reliability Testing Results of Surface Mounted Lead Free Soldering Materials and Processes, 2005

  Article published in SMT magazine related to TURI's Lead-Free work. The world-wide movement to phase out lead from electronic products presents many challenges for companies throughout the electronics supply chain. The University of Massachusetts at Lowell has brought together many Massachusetts/New England firms to collaborate on the manufacture and testing of lead-free printed wiring boards (PWBs). The results of the first set of experiments, published in 2001, showed that zero-defect soldering is achievable with lead-free materials. Following thermal cycling, the PWBs were visually inspected and the leads were pull-tested for reliability analysis. They compared favorably to a baseline of lead soldered PWBs A follow-on design of experiments was created in 2002 and a second set of test PWBs was made and tested in 2003. Three lead-free solder pastes based on Sn/Ag/Cu alloys were reflowed using either air or nitrogen with five PWB surface finishes, four component types with two types of component finish. Visual inspection and pull-testing were performed and published as completed in APEX, SMTI and IEEE conferences. This paper summarizes the testing results and introduces further research plans in volume manufacturing of lead free PWBs for the phase III testing sponsored by the EPA. Download PDF file (388.79 kB)

A Successful Transition To Lead-Free

  August 2006 article published in SMT Magazine, co-authored by Greg Morose, project manager at TURI. The article documents the positive test results of an actual implementation of a lead-free printed wiring board for Mercury Computer Systems. Download PDF file (136.35 kB)

Transition to Lead-Free Electronics Case Study

  Transition to Lead-Free Electronics Case Study, presented at IPC/JEDEC Lead Free Conference August 2006 Download file (2.76 MB)

Phase III - Visual and Reliability Testing Results

  Visual and Reliability Testing Results of Circuit Boards Assembled with Lead-Free Components, Soldering Materials, and Processes. APEX February 2006 Download file (3.21 MB)

Phase II - Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes

  Testing and Analysis of Surface Mounted Lead Free Soldering Materials and Processes Download PDF file (373.90 kB)

Phase I - Process and Material Selection for Zero Defects and Superior Adhesion Lead Free SMT Soldering

  Process and Material Selection for Zero Defects and Superior Adhesion Lead Free SMT Soldering (SMTA 2001) Download PDF file (1.51 MB)

Phase I - Zero Defects Lead Free Soldering

  Zero Defects Lead Free Soldering (SMTA Presentation 2001) Download PDF file (348.25 kB)

Phase I - Zero Defects Lead Free Soldering Presentation at STEP

  Zero Defects Lead Free Soldering Presentation at STEP (STEP Presentation 2001) Download PDF file (126.55 kB)

Phases I & II - Lead Free Soldering Materials, Reliability and Process Optimization

  Lead Free Soldering Materials, Reliability and Process Optimization (Presentation May 20, 2002) Download PDF file (192.87 kB)
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